Product Description : Thermal Encapsulant 1:1

Two-component thermal silicone encapsulant, use imported organic silicone as the main material , select the polymer materials as fillers, manufactured electronic pouring sealant . It has heat conducting , flame retardance, adhesion , sealing, waterproof, encapsulation properties .

Application :

1.Power switch ,

2.LED light / driver ,

3.Electron component ,

4.Electronic circuits etc.

Specification：

1kg / pot, 10kg / pot , 25kg / pot

Color : Dark Grey , White , Transparent

Feature:

1.) High thermal conductivity -- provides the highest thermal conductivity with its viscosity range in the world.

2.) Low Stress--exhibits low shrinkage and stress on components as it is curing;low thermal expansion after curing.

3.) Highly reliable--composed of an addition-curing polydimethly siloxane polymer that will not deploymerize when heated in confined spaces.

4.) Low Viscosity--maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.

5.) Environmentally Resistant--provides excellent thermal shock resistance.

6.) UL Rated--meets requirements of UL 94 V-O standard;provides excellent flame retardancy.