Product Name : PM460 Thermal Gap Pad

PM460 thermal gap pad is based on the high thermal conductivity of silicon, boron nitride and aluminum oxide powder mixed into, the product with stable characteristic, can meet the occasions which need high requirements of heat radiating. The product has good thermal conductivity, at the same time, it has slightly adhesive, easy to operate.

PM460 thermal gap pad is use good thermal conductivity and insulation performance of soft silicone material, soft and elastic characteristics, placed between the power heating device and heat dissipating structure, the power module generates heat effectively transmit to the radiating component.

Applications:

1. Car engine module and vehicle electronic equipment

2. Notebook computer, desktop CPU

3. Flat panel TV, mobile equipment, high-speed hard disk driver

4. Between semiconductor and heat sink

5. Computer, PC server, workstation

6. LED lighting device and mass storage device

Performance and characteristics:

1.High thermal conductivity, heat transfer coefficient 4.6W/m-k

2.Stable performance, low thermal resistance, effectively improve the heat transfer speed

3.Low hardness , its viscosity high, easy to use

4.By UL and V-O certification standards

Specification:

Standard size 300mm*300mm, 200mm*400mm , other size can be customized